this is information on a product in full production. may 2013 docid13180 rev 2 1/8 EMIF02-SPK01C2 2 line ipad?, emi filter including esd protection datasheet - production data features ? emi symmetrical (i/o) low-pass filter ? high efficiency emi filter (-33 db @ 900 mhz) ? very low pcb space consumption: 1.07 mm x 1.47 mm ? very thin package: 0.695 mm ? coating resin on back side and lead free package ? high efficiency in esd suppression ? high reliability offered by monolithic integration ? high reduction of parasitic elements through integration and wafer level packaging. complies with the following standards: ? iec 61000-4-2 level 4, on input pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec 61000-4-2 level 1, on output pins: ? 2 kv (air discharge) ? 2 kv (contact discharge) ? mil std 883g - method 3015-7 class 3 tm : ipad is a trademark of stmicroelectronics applications where emi filtering in esd sensitive equipment is required: ? mobile phones and communication systems ? computers and printers and mcu boards description the EMIF02-SPK01C2 is a highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the flip-chip packaging means the package size is equal to the die size.this filter includes esd protection circuitry, which prevents damage to the application when it is subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. basic cell configuration coated flip-chip package b 1 32 c a i1 o1 gnd i2 o2 input output gnd gnd gnd low-pass filter ri/o = 10 cline = 200 pf www.st.com
characteristics EMIF02-SPK01C2 2/8 docid13180 rev 2 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute ratings (limiting values) symbol parame ter value unit t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 8 v i rm v rm = 3 v per line 500 na r i/o tolerance 20% 10 ? c line v r = 0 v 200 pf i v i pp i pp v cl v cl v br v br v rm v rm i r i r i rm i rm i rm i rm i r i r i pp i pp v rm v rm v br v br v cl v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i = peak pulse current i = breakdown current v = forward voltage drop br rm rm rm cl pp r f c = line capacitance line r = dynamic impedance d
docid13180 rev 2 3/8 EMIF02-SPK01C2 characteristics 8 figure 8. line capacitance versus applied voltage figure 4. s21 (db) attenuation measurement figure 5. analog crosstalk measurement db 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 1.0m - - - - - - f (hz) db 100.0k 1.0m 10.0m 100.0m 1.0g -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 - - - - - - f (hz) figure 6. esd response to iec 61000-4-2 (+15 kv air discharge) on one input v in and one output v out figure 7. esd response to iec 61000-4-2 (- 15 kv air discharge) on one input v in and one output v out c(pf) 0 50 100 150 200 250 012345 v (v) r f=1mhz v osc =30mv rms t j =25c
characteristics EMIF02-SPK01C2 4/8 docid13180 rev 2 figure 9. aplac model figure 10. aplac parameters model = d1 model = d2 model = d2 in1 model = d1 out1 rbump lbump lbump rbump rspk lspk rbump lbump lbump rbump rspk lspk model = d3 in2 out2 gnd lsub rsub rbump lbump lgnd rgnd cgnd gnd EMIF02-SPK01C2 model ground return aplacvar ls 1nh aplacvar rs 150m aplacvar rspk 10 aplacvar lspk 10p aplacvar cdiode1 234pf aplacvar cdiode2 3.5ppf aplacvar cdiode3 1nf aplacvar lbump 50ph aplacvar rbump 10m aplacvar rsub 0.5m aplacvar lsub 10ph aplacvar rgnd 1m aplacvar lgnd 50ph aplacvar cgnd 0.15pf model d1 cjo=cdiode1 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.7 vj=0.6 tt=50n model d2 cjo=cdiode2 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.3 vj=0.6 tt=50n model d3 cjo=cdiode3 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.12 vj=0.6 tt=50n
docid13180 rev 2 5/8 EMIF02-SPK01C2 package information 8 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com. ecopack ? is an st trademark. figure 11. flip-chip dimensions figure 12. marking figure 13. footprint 1. 07 mm 50 m 1. 47 mm 50 m 500 m 15 315 m 50 500 m 10 250 m 10 695 m 50 x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) e copper pad diameter : 250 m recommended , 300 m max solder stencil opening : 330m solder mask opening recommendation : 340 m min for 300 m copper pad diameter
package information EMIF02-SPK01C2 6/8 docid13180 rev 2 figure 14. flip-chip tape and reel specification dot i dent i f yi ng pi na1 l ocat i on u ser di rect i on of unreel i ng all dimensions are typical values in mm 4. 0 4. 0 2. 0 8. 0 1. 75 3. 5 ? 1. 55 0. 73 0. 22 st xxz yw w st xxz yw w st xxz yw w st xxz yw w st xxz yw w st xxz yw w
docid13180 rev 2 7/8 EMIF02-SPK01C2 ordering information 8 3 ordering information figure 15. ordering information scheme 4 revision history table 3. ordering information order code marking package weight base qty delivery mode EMIF02-SPK01C2 fx flip chip 2.3 mg 5000 tape and reel 7? emif yy - xxx zz cx emi filter number of lines information package 3 letters = application 2 digits = version c = coated flip-chip x = 2: leadfree pitch = 500 m, bump = 315 m table 4. document revision history date revision changes 26-jan-2006 1 initial release. 22-may-2013 2 updated figure 13 .
EMIF02-SPK01C2 EMIF02-SPK01C2 8/8 docid13180 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com EMIF02-SPK01C2
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